Campuses:

Integrated Multiscale Process Simulation in Microelectronics

Tuesday, June 6, 2000 - 9:30am - 10:25am
Keller 3-180
Timothy Cale (Rensselaer Polytechnic Institute)
After a brief review of multiscale simulation work for thermal CVD, I will focus on efforts in electrochemical deposition. I will finish up by discussing developing efforts in chemical mechanical planarization.

Joint work with M.O. Bloomfield, S. Soukane, K. Jansen, J. Tichy.