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Talk Abstract
Integrated Multiscale Process Simulation in Microelectronics

Timothy S. Cale
Rensselaer Polytechnic Institute

After a brief review of multiscale simulation work for thermal CVD, I will focus on efforts in electrochemical deposition. I will finish up by discussing developing efforts in chemical mechanical planarization.

Joint work with M.O. Bloomfield, S. Soukane, K. Jansen, J. Tichy.

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