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Talk Abstract

Three-Dimensional Modeling of Optical Lithographic Patterns Used To Manufacture Computer Chips

Three-Dimensional Modeling of Optical Lithographic Patterns Used To Manufacture Computer Chips

Optical lithography is the technology used to create high-density
VLSI computer circuit patterns. It is fair to say that small
improvements and tighter control of a lithographic process usually
lead to improved device yield and device performance. Significant
advances in lithography often lead to big competitive advantages
for manufacturers. Advancing lithographic technology is not
easy. Evaluating engineering proposals is often very expensive.
Mathematical modeling of lithography process steps often allows
faster evaluation of new lithographic ideas and consequently
cuts cost substantially. In this talk I will discuss models
and the results of models used to simulate the three basic steps
used to create photoresist patterns for VLSI circuits, *i.e.*
(1) the 3D optical imaging and exposure step, (2) the 3D exposure
product redistribution by diffusion during the very important
bake step, and (3) the 3D dissolution of the exposed material
during the development step. A video of the 3D dissolution process
computed using the RD3D (Resist Development In 3 Dimensions)
algorithm invented by the author will be shown.